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ABILITY's innovative hardware design will be presented at the IEEE EuroSime conference

17 January 2025

Détails

Great congrats to our consortium partner, CEA, who will be presenting their research on the development of a piezoelectric patch at the IEEE EuroSime conference venue in April 2025 (https://www.eurosime.org/).

This publication (titled: "Fabrication and Electromechanical Characterization of Piezoelectric Patches for OLED-Based Haptic Interfaces") will report the outcome of CEA's research on the development and the integration of piezoelectric patch on the ABILITY haptic tablet and its evaluation through electrical and electromechanical characterizations.

Liens utiles*

Utrecht, The Netherlands

Création de dispositifs centrés sur l'humain et multisensoriels

Contact us

If you want to contact the ABILITY Coordination Team, please send an email to:

sabrina.paneels@cea.fr

In addition, we encourage you to meet the ABILITY Management Board so you can redirect your question accordingly.

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Merci pour votre subscription!

Ce projet a reçu un financement du programme de recherche et d'innovation Horizon de l'Union européenne dans le cadre de la convention de subvention Nº 101070396

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